{"data":{"id":210966,"slug":"senior-advanced-packaging-reliability-engineer","type":"job","title":"Senior Advanced Packaging & Reliability Engineer","description":"Senior Advanced Packaging & Reliability Engineer\nJoin Smart High Tech\nSmart High Tech is a Swedish DeepTech company developing advanced graphene-enhanced Thermal Interface Materials (TIM) for next-generation AI, semiconductors, high-performance computing, data centres and advanced electronics.\nAs semiconductor performance and power density continue to increase, advanced packaging, thermal management and long-term reliability are becoming increasingly critical.\nWe are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer who wants to help solve these challenges and contribute to the next generation of semiconductor technology.\nYour Mission\nAs Senior Advanced Packaging & Reliability Engineer, you will work at the intersection of advanced packaging, materials science, thermal management and reliability engineering.\nYou will help us understand how our materials and interfaces perform within advanced semiconductor packaging environments by combining simulation, experimental testing, reliability assessment and failure analysis.\nYou will work closely with our R&D, engineering and product development teams as well as international customers, research institutes and technology partners.\nWhat You'll Be Doing\nAdvanced Packaging & Reliability\nEvaluate materials and interfaces for advanced semiconductor packaging applications.\nWork with technologies such as 2.5D\/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.\nDevelop and perform reliability assessments and testing.\nInvestigate thermal, mechanical and interfacial failure mechanisms.\nConduct failure analysis and root-cause investigations.\nModelling & Simulation\nPerform thermo-mechanical modelling and finite element analysis.\nModel stresses, deformation and failure mechanisms in packaging structures and interfaces.\nCorrelate simulation results with experimental data.\nUse simulation and testing to support material and product optimisation.\nR&D & Product Development\nSupport the development and qualification of new materials and products.\nTranslate technical findings into practical engineering improvements.\nContribute to customer qualification and technical development projects.\nCollaborate with universities, research institutes, laboratories and international technology partners.\nWhat We're Looking For\nMSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or a related field.\nExperience in semiconductor packaging and\/or power electronics packaging.\nStrong understanding of advanced packaging technologies, materials and interfaces.\nExperience in reliability engineering and\/or failure analysis.\nExperience with thermo-mechanical modelling and finite element analysis.\nFamiliarity with ANSYS, Abaqus and\/or COMSOL.\nStrong analytical and problem-solving capabilities.\nFluent English, written and spoken.\nIt's a Strong Plus If You Have\nA PhD within a relevant technical discipline.\nExperience with 2.5D\/3D integration, heterogeneous integration, WLCSP, flip-chip or advanced interconnects.\nKnowledge of solder joints, Cu-based interconnects, sintered materials, microbumps or bonding technologies.\nExperience with electromigration, thermal fatigue, creep, fracture or interfacial reliability.\nExperience with SEM, TEM, FIB or similar characterisation techniques.\nExperience from leading semiconductor companies, packaging companies or research institutes such as IMEC, Fraunhofer, Max Planck, NXP, Nexperia, Infineon, STMicroelectronics, Intel, TSMC, ASE or Amkor.\nPublications or patents within advanced packaging, interconnect technologies or reliability.\nWho You Are\nYou're technically curious, analytical and motivated by solving complex engineering challenges.\nYou're comfortable moving between simulation, experimental testing and physical analysis and can translate scientific findings into practical engineering solutions.\nYou enjoy working collaboratively in an international DeepTech environment where research, engineering and industrialisation come together.\nWhy Join Smart High Tech?\nAt Smart High Tech, you'll work with advanced graphene materials and thermal management technologies addressing one of the fundamental challenges facing next-generation computing: heat.\nYou'll work alongside experienced researchers and engineers and collaborate with international technology partners and customers.\nThis is an opportunity to combine deep scientific expertise with real-world industrial impact and contribute directly to our journey from advanced R&D towards industrialisation and global scale.\nReady to Join Us?\nIf you have experience in advanced semiconductor packaging and reliability engineering and want to contribute to the next generation of thermal management technology, we'd like to hear from you.\nApply today. Applications are reviewed continuously.\nOpen to All\nWe focus on your expertise, not your other circumstances. We are open to adapting the role or workplace to your needs.","language":"sv","is_translated":true,"title_original":"Senior Advanced Packaging & Reliability Engineer","description_original":"Senior Advanced Packaging & Reliability EngineerJoin Smart High Tech\nSmart High Tech is a Swedish DeepTech company developing advanced graphene-enhanced Thermal Interface Materials (TIM) for next-generation AI, semiconductors, high-performance computing, data centres and advanced electronics.\nAs semiconductor performance and power density continue to increase, advanced packaging, thermal management and long-term reliability are becoming increasingly critical.\nWe are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer who wants to help solve these challenges and contribute to the next generation of semiconductor technology.\nYour Mission\nAs Senior Advanced Packaging & Reliability Engineer, you will work at the intersection of advanced packaging, materials science, thermal management and reliability engineering.\nYou will help us understand how our materials and interfaces perform within advanced semiconductor packaging environments by combining simulation, experimental testing, reliability assessment and failure analysis.\nYou will work closely with our R&D, engineering and product development teams as well as international customers, research institutes and technology partners.\nWhat You'll Be DoingAdvanced Packaging & Reliability\nEvaluate materials and interfaces for advanced semiconductor packaging applications.\n\n\nWork with technologies such as 2.5D\/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.\n\n\nDevelop and perform reliability assessments and testing.\n\n\nInvestigate thermal, mechanical and interfacial failure mechanisms.\n\n\nConduct failure analysis and root-cause investigations.\n\nModelling & Simulation\nPerform thermo-mechanical modelling and finite element analysis.\n\n\nModel stresses, deformation and failure mechanisms in packaging structures and interfaces.\n\n\nCorrelate simulation results with experimental data.\n\n\nUse simulation and testing to support material and product optimisation.\n\nR&D & Product Development\nSupport the development and qualification of new materials and products.\n\n\nTranslate technical findings into practical engineering improvements.\n\n\nContribute to customer qualification and technical development projects.\n\n\nCollaborate with universities, research institutes, laboratories and international technology partners.\n\nWhat We're Looking For\nMSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or a related field.\n\n\nExperience in semiconductor packaging and\/or power electronics packaging.\n\n\nStrong understanding of advanced packaging technologies, materials and interfaces.\n\n\nExperience in reliability engineering and\/or failure analysis.\n\n\nExperience with thermo-mechanical modelling and finite element analysis.\n\n\nFamiliarity with ANSYS, Abaqus and\/or COMSOL.\n\n\nStrong analytical and problem-solving capabilities.\n\n\nFluent English, written and spoken.\n\nIt's a Strong Plus If You Have\nA PhD within a relevant technical discipline.\n\n\nExperience with 2.5D\/3D integration, heterogeneous integration, WLCSP, flip-chip or advanced interconnects.\n\n\nKnowledge of solder joints, Cu-based interconnects, sintered materials, microbumps or bonding technologies.\n\n\nExperience with electromigration, thermal fatigue, creep, fracture or interfacial reliability.\n\n\nExperience with SEM, TEM, FIB or similar characterisation techniques.\n\n\nExperience from leading semiconductor companies, packaging companies or research institutes such as IMEC, Fraunhofer, Max Planck, NXP, Nexperia, Infineon, STMicroelectronics, Intel, TSMC, ASE or Amkor.\n\n\nPublications or patents within advanced packaging, interconnect technologies or reliability.\n\nWho You Are\nYou're technically curious, analytical and motivated by solving complex engineering challenges.\nYou're comfortable moving between simulation, experimental testing and physical analysis and can translate scientific findings into practical engineering solutions.\nYou enjoy working collaboratively in an international DeepTech environment where research, engineering and industrialisation come together.\nWhy Join Smart High Tech?\nAt Smart High Tech, you'll work with advanced graphene materials and thermal management technologies addressing one of the fundamental challenges facing next-generation computing: heat.\nYou'll work alongside experienced researchers and engineers and collaborate with international technology partners and customers.\nThis is an opportunity to combine deep scientific expertise with real-world industrial impact and contribute directly to our journey from advanced R&D towards industrialisation and global scale.\nReady to Join Us?\nIf you have experience in advanced semiconductor packaging and reliability engineering and want to contribute to the next generation of thermal management technology, we'd like to hear from you.\nApply today. Applications are reviewed continuously.\n\u00d6ppen f\u00f6r alla\nVi fokuserar p\u00e5 din kompetens, inte dina \u00f6vriga f\u00f6ruts\u00e4ttningar. Vi \u00e4r \u00f6ppna f\u00f6r att anpassa rollen eller arbetsplatsen efter dina behov.","price":null,"currency":"SEK","status":"active","noindex":true,"location":{"address":"Terminalv\u00e4gen 12","full_address":null,"city":"G\u00f6teborg","country":"SE","latitude":57.701605066051,"longitude":11.807873283136},"metadata":{"region":"V\u00e4stra G\u00f6talands l\u00e4n","duration":"Tills vidare","employer":"SHT Smart High-Tech Aktiebolag","postcode":"41879","positions":1,"profession":"Civilingenj\u00f6r, forskning och utveckling, kemi","salary_type":"Fast m\u00e5nads- vecko- eller timl\u00f6n","employer_url":"https:\/\/shtsmarthightech.teamtailor.com","scope_of_work":"100\u2013100 %","working_hours":"Heltid","contact_person":"Benjamin von Jahf","driving_license":true,"employment_type":"full_time","occupation_field":"Yrken med teknisk inriktning","employer_workplace":"SHT Smart High Tech","translation_status":"done","experience_required":true,"employment_type_label":"Vanlig anst\u00e4llning"},"user_id":null,"is_sponsored":false,"views_count":0,"ai_views_count":3,"bot_views_count":0,"ai_vendor_counts":{"anthropic":3},"visibility":"public","submission_source":null,"submission_ai_name":null,"has_owner_email":true,"can_contact_owner":true,"phone":"0760101007","owner_email":"bvj@smarthightech.com","images":[],"published_at":"2026-09-14T17:08:28+00:00","expires_at":"2027-03-13T23:59:59+00:00","created_at":"2026-09-15T03:25:05+00:00","updated_at":"2026-09-15T04:02:12+00:00"}}